Aalto Microelectronics Research Center

Principle of operation

Aalto Microelectronics Reaearch Center is a research unit that gathers together professors, researchers and students to collaborate and enhance the efficiency of activities on the field of microelectronics. We aim for highest quality research and education in close co-operation with our industrial partners and research funding organizations to retain the high societal relevance of activities that has been enabler of the global success of Finnish electronics industry.

Covering the full stack

Aalto microelectronics research center covers the whole stack of microelectronics from materials to system design. In our research and education, we aim for creating seamless cross-cutting understanding that covers the all areas of microelectronics: advanced materials and fabrication, packaging and reliability, and microelectronics circuit design.

Microelectronics circuit design

Our activities cover wide variety of categories of microelectronics circuit design: building blocks for high-frequency RF tranceivers, transceiver systems, sensor front-ends, digital signal processing hardware and RISC-V processor systems. We aim for high design efficiency through utilization and continuous improvement of programmatic design methodology that merges hardware design to programming in a state-of-the-art design and verification environment.

Research themes

Advanced materials and fabrication

The research and education is focused on semiconductor materials and device physics. Our interests cover the whole scientific spectrum from fundamental physical phenomena to the search for cutting-edge applications in collaboration with microelectronic industry. We aim for unique tailoring of semiconductor wafer properties for advanced RF, power and sensor electronics.  One of our strengths is expertise in advanced characterization including contactless probing of different material properties and electronic device performance. Additionally we have know-how for proof-of-concept device and circuit fabrication.

Research themes

Packaging and reliability

The research is focused on new materials, three-dimensional (3D) integration and reliability of electronics and microelectromechanical systems (MEMS). We use the cutting-edge infrastructure of OtaNano, providing centralized access to advanced nanofabrication, nanomicroscopy and low-noise measurement facilities. In addition, the group has its own reliability testing laboratory, and uses different modelling tools to anticipate and rationalize reliability performance of heterogeneous integration in micro- and nanosystems.

Research themes

Collaborators

Got interested? We are always open for proposals. Please contact one of the co-directors.